 |
Your search returned 24 records. Click on the hyperlinks to view further details of Titles.. |
|
Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
|
Year : 1995 Volume number : 18 Issue: 03 |
A Device Life Cycle Analysis Of The Wsi Associative String Processor
(Article)
Subject:
Associativity
,
Processor
Author:
R. Mike
Lea
H
Bolouri
page:
406
-
415
Defect And Fault Tolerant Interconnection Strategies For Wasp Devices
(Article)
Subject:
Defect
,
Interconnect
,
Strategic Alliances
Author:
Mohammed B. A.
Hussaini
R. Mike
Lea
Hamid
Bolouri
page:
416
-
423
Influence Of Process Parameter Variations On The Signal Distribution Behavior Of Wafer Scale Integration Devices
(Article)
Subject:
Influence Explorer
,
Behavior
,
Wafer
,
Integration
Author:
Thomas
Gneiting
Ian P.
Jalowiecki
page:
424
-
430
Test Vehicle For A Wafer-Scale Field Programmable Gate Array
(Article)
Subject:
Test Algorithm
,
Wafer
,
Gate Drives
Author:
Benoit
Dufort
G. H.
Chapman
page:
431
-
437
A Wafer Level Testability Approach Based On An Improved Scan Insertion Technique
(Article)
Subject:
Wafer
,
Approach
,
Insertion Force
Author:
C
Bolchini
G.
Buonanno
Giacomo
Buonanno
page:
438
-
447
Modeling Intermediate Tests For Fault-Tolerant Multichip Module Systems
(Article)
Subject:
Modeling
,
Tests
,
Multichip Module
Author:
Sungsoo
Kim
Fabrizio
Lombardi
page:
448
-
455
Design Of 0.35-Mm Pitch Qfp Lead And Its Assembly Technology
(Article)
Subject:
Assembled Electrodes
,
Technologies
Author:
Makoto
Totani
Mami
Nagatake
Yasuhiro
Teshima
page:
456
-
462
296 Lead Fine Pitch (0.4 Mm) Thin Plastic Qfp Package With Tab Interconnect
(Article)
Subject:
Thin Plate
,
Tab
,
Fine Tuning
Author:
Praveen
Jain
page:
463
-
470
Development Of 0.45-Mm Thick Ultra-Thin Small Outline Package
(Article)
Subject:
Development
,
Thick Film
,
Ultra-Thick Photoresist
Author:
Susumu
Omi
Tomoyo
Maruyama
Takamichi
Maeda
page:
471
-
477
A Test Chip Design For Detecting Thin-Film Cracking In Integrated Circuits
(Article)
Subject:
Test
,
Integrated
,
Chenille Yarn
Author:
Kua L.
Chen
Vladimir
Zarudnij
page:
478
-
484
Moisture Sensitivity And Reliability Of Plastic Thermally Enhanced Qfp Packages
(Article)
Subject:
Moisture
,
Enhanced
,
Plastic
Author:
Laurene
Yip
page:
485
-
490
Popcorn Phenomena In A Ball Grid Array Package
(Article)
Subject:
Array
,
Ball Grid Array
Author:
Seung-Ho
Ahn
Young-Shin
Kwon
page:
491
-
465
Simultaneous Switching Noise: Influence Of Plane-Plane And Plane-Signal Trace Coupling
(Article)
Subject:
Simultaneous Update
,
Noise
,
Plane Graph
Author:
Arun
Vaidyanath
John L.
Prince
Andreas C.
Cangellaris
page:
496
-
502
Compliant Bumps For Adhesive Flip-Chip Assembly
(Article)
Subject:
Compliant Motion
,
Flip Chip
,
Assembly
Author:
Kathryn
Keswick
Randy L.
German
Rich
Nolan
page:
503
-
510
Application Of Cfd Technology To Electronic Thermal Management
(Article)
Subject:
Application
,
Cfd
,
Thermal
Author:
Tien-Yu Tom
Lee
Mali
Mahalingam
B
Chambers
page:
511
-
250
Analysis Of Transient Behavior Of Vertical Interconnects In Stacked Circuit Board Layers Using Quasi-Static Techniques
(Article)
Subject:
Analysis
,
Interconnects
,
Circuit Breaker
Author:
Guanghua
Pan
Xiaomin
Zhu
Barry K.
Gilbert
page:
521
-
531
Analysis Of Multilayer-Multiconductor Structures On Anisotropic Substrates Using The Finite Difference Method
(Article)
Subject:
Analysis Model
,
Diferentiation
,
Using Jce
Author:
Deepak D.
Jatkar
Benjamin
Beker
page:
532
-
536
Metallurgical Reactions At The Interface Of Sn/Pb Solder And Electroless Copper-Plated Aln Substrate
(Article)
Subject:
Metallurgical Phase Transformation
,
Copper-Based Catalysts
Author:
Bi-Shiou
Chiou
Jiann-Jaur
Chang
Jenq-Gong
Duh
page:
537
-
542
Design Of Solder Joints For Self-Aligned Optoelectronic Assemblies
(Article)
Subject:
Design Of Seismic
,
Self - Air Breathing
Author:
Wei
Lin
Y.C.
Lee
Susan K.
Patra
page:
543
-
551
A Self-Aligned Optical Subassembly For Multi-Mode Devices
(Article)
Subject:
Self-Aligning Bearing
,
Multi-Mode
,
Devices
Author:
Mino F.
Dautartas
Greg E.
Blonder
Y. C.
Chen
page:
552
-
557
Multigigabit Multichannel Optical Interconnection Modules For Asynchronous Transfer Mode Switching Systems
(Article)
Subject:
Optical
,
Interconnect
,
Switching Activity
Author:
Yoshimitsu
Arai
Kunio
Koyabu
Jun
Nishikido
page:
558
-
564
Processing And Characterization Of Benzocyclobutene Optical Waveguides
(Article)
Subject:
Processing
,
Optical Waveguides
Author:
Casey F.
Kane
Robert R.
Krchnavek
page:
565
-
571
Computer-Controlled Pressure-Dispensed Multimode Polymer Waveguides
(Article)
Subject:
Experiment
,
Losses
,
Waveguide Antenna
Author:
Barrie P.
Keyworth
James N.
Mcmullin
R.
Narendra
page:
572
-
577
Electrical Packaging Impact On Source Components In Optical Interconnects
(Article)
Subject:
Electrical Parameters
,
Optical Interconnects
Author:
Mark A.
Neifeld
Wu-Chun
Chou
page:
578
-
595
|
|
| | |
